Events
Latest Heat & Cool Molding Seminar 2014
2014.07.26
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Date (period): July 24-25, 2014
Venue (country): Our Osaka office
Theme (contents): 4 seminars and a tour of Tech Studio studio 1, 2, 3,
The latest Heat & Cool molding seminar 2014 has ended.
factor4 tech-studios in our Osaka office, Mitsubishi Corporation Technos Co., Ltd., Manufacture Milling Machinery Co., Ltd., Nippon Denki Co., Ltd., and our four companies co-sponsored four seminars and tech studio studio1, We held a few tours. Both days were very hot and many people participated, and the event was a great success.
factor4 tech-studios will continue to look forward to your visit at any As necessary. If you have any interests or wishes, please contact your nearest sales office or our sales office.
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Thank you to everyone who participated.