Date (period): July 24-25, 2014
Venue (country): Our Osaka office
Theme (contents): 4 seminars and a tour of Tech Studio studio 1, 2, 3,

The latest Heat & Cool molding seminar 2014 has ended.

factor4 tech-studios in our Osaka office, Mitsubishi Corporation Technos Co., Ltd., Manufacture Milling Machinery Co., Ltd., Nippon Denki Co., Ltd., and our four companies co-sponsored four seminars and tech studio studio1, We held a few tours. Both days were very hot and many people participated, and the event was a great success.

factor4 tech-studios will continue to look forward to your visit at any As necessary. If you have any interests or wishes, please contact your nearest sales office or our sales office.

Thank you to everyone who participated.